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Process introduction
PVD process introduction
Vacuum coating is a surface treatment process in which a metal, a non-metal, a gas, or the like, such as titanium, gold, graphite, or quartz, is formed into a film on a substrate by sputtering or evaporation in a vacuum.
Compared with the traditional chemical coating method, vacuum coating has many advantages: it is environmentally friendly without pollution to the environment; it has no harm to the operator; the coating is firm, the film is dense, the film thickness is uniform, and the film is corrosion resistant. Good value for money.
The methods commonly used in vacuum coating technology are: evaporation coating (including arc evaporation, electron gun evaporation, resistance wire evaporation, etc.), sputter coating (including DC magnetron sputtering, medium frequency magnetron sputtering, RF sputtering, etc.) These methods are collectively referred to as Physical Vapor Deposition, abbreviated as PVD. The corresponding chemical vapor deposition (Chemical Vapor Deposition) is referred to as CVD technology.
The so-called "IP" ion plating in the industry is a function of the PVD technology in which various gas ions and metal ions participate in the film formation process and play an important role in order to emphasize the role of ions. Ion plating. It can be inaccurately considered that IP technology is another name for PVD technology.
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